Board Level Manufacturing
From high speed Surface Mount Assembly to automated Through Hole Assembly, EMS2020 provides flexible board level manufacturing solutions to meet your complex requirements across your entire product lifecycle.
Our manufacturing capabilities include:
- High speed surface mount assembly
- Small size (0201) and Ball Grid Array (BGA) placement and X-ray verification
- Through Hole Assembly
- Automatic In Circuit Test (ICT)
- Backplane assembly
- Radio frequency calibration and performance testing
- Functional test and final assembly
- Conformal coating
Whether you're an OEM for the communications, automotive, medical, multimedia, peripherals, computing or industrial controls industries, EMS2020 offers flexible design and development support solutions to meet your complex needs. After all, we don't want to just be your vendor today, but your EMS partner for the future.